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Solvent processing of PMMA and COC chips for bonding devices with optical quality surfaces

Ogilvie, I.R.J.; Sieben, V.J.; Floquet, C.F.A.; Zmijan, R.; Mowlem, M.C.; Morgan, H.. 2010 Solvent processing of PMMA and COC chips for bonding devices with optical quality surfaces. In: Verpoorte, S.; Andersson-Svahn, H.; Emnéus, J.; Pamme, N., (eds.) 14th International Conference on Miniaturized Systems for Chemistry and Life Sciences. Stoughton WI, USA, The Printing House for Chemical and Biological Microsystems Society, 1244-1246.

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Abstract/Summary

Many prototype microfluidic devices are manufactured by some form of micromachining or injection molding which often leaves poor quality surface. This work presents a simple method that both significantly reduces surface roughness of microfluidic chips and at the same time is used to bond devices. The method has been tested on devices made from poly(methyl methacrylate) (PMMA) and cyclic olefin copolymer (COC). The technique uses a solvent vapour exposure process which creates an irreversible bond between two substrates. It also re-flows the material, producing surfaces with optical quality.

Item Type: Publication - Book Section
ISBN: 978-0-9798064-3-8
Additional Keywords: Solvent vapour polishing, poly(methyl methacrylate), cyclic olefin copolymer, Microfluidics
Date made live: 21 Aug 2013 08:43 +0 (UTC)
URI: http://nora.nerc.ac.uk/id/eprint/503026

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